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50W 100W 150W Air-Cooled Laser Diode Stack | 755/808/1064nm

50W 100W 150W Air-Cooled Laser Diode Stack | 755/808/1064nm

Model Number:XTB
Output power:50/100/150W
Wavelength: 755/808/1064±10nm
Bar quantity :1/2/3 Pcs
Bar interval:1.6mm
Light size: 12*9 mm X mm
Working current :45~50A
Working voltage:1.8/3.6/5.4V
Duty cycle: 40%
Pulse width:Duty cycle:*1000/Hz ms
Frequency: 1~5 Hz
Cooling Method: Fan heat dissipation
Fan parameter: DC5.0V,40*40*20t,7200rpm
Air volume: 7.6 CFM
Ambient temperature: -10℃~28℃(Continuous operation 30min) ℃
Operation temperature: -109C~45C(Strict control)℃

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Product Introduction

Why Choose a Compact Air-Cooled Diode Laser Stack?

For OEM systems that do not require the output power of large multi-bar water-cooled modules, a compact air-cooled diode laser stack can provide a simpler and more space-efficient integration solution.

The XTB series is designed around 50W, 100W and 150W output configurations with 1, 2 or 3 laser bars, combining a low bar count with forced-air cooling. This makes it especially suitable for compact laser systems where installation space, cooling complexity and electrical load need to be carefully controlled.

Compact 1–3 Bar Architecture

Unlike high-power diode laser stacks that may use 10, 20 or more laser bars, the XTB platform uses a 1-bar, 2-bar or 3-bar configuration depending on the required output power.

This low-bar-count design helps reduce the overall size of the laser source while giving OEM engineers a straightforward way to select the required power level.

Typical configurations include:

50W – 1 laser bar

100W – 2 laser bars

150W – 3 laser bars

This makes the XTB a practical choice for applications that need a compact laser diode stack rather than a large high-power laser module.

Forced-Air Cooling Without an External Water Loop

The XTB uses forced-air cooling, eliminating the need for an external water circulation system in applications that operate within the specified thermal and duty-cycle limits.

Compared with a conventional water-cooled diode laser stack, an air-cooled design can simplify system integration by reducing the need for:

Water pumps

Cooling hoses

Reservoirs

Flow sensors

Water fittings

Additional plumbing space

For compact OEM equipment, removing the water-cooling loop can help simplify the internal layout and reduce the number of auxiliary components required around the laser source.

Designed for Space-Constrained OEM Systems

Mechanical space is often limited in portable, desktop and compact laser equipment.

The combination of low bar count, compact dimensions and fan-assisted heat dissipation allows the XTB laser diode stack to be integrated into systems where a larger water-cooled stack may be unnecessary or difficult to accommodate.

This makes it suitable for OEM projects where engineers are balancing:

laser output power + available installation space + thermal management + system complexity.

Three Power Levels on One Compact Platform

The 50W, 100W and 150W versions allow equipment manufacturers to use the same general XTB platform across different product configurations.

For example:

Configuration Bar Count Output Power Typical Positioning
XTB 50W 1 bar 50W Lowest power and smallest configuration
XTB 100W 2 bars 100W Balanced power and compact size
XTB 150W 3 bars 150W Highest output within the compact XTB platform

This modular approach can be useful for OEM manufacturers developing several equipment models with different output requirements.

When Is an Air-Cooled Diode Laser Stack a Better Fit?

A 50W–150W air-cooled laser diode stack is worth considering when:

  • Your system does not require a 500W+ multi-bar laser source
  • Internal installation space is limited
  • A water-cooling loop would add unnecessary system complexity
  • The application uses relatively low pulse frequency and controlled duty cycle
  • You need a compact 755nm, 808nm or 1064nm diode laser source
  • The laser stack must be integrated into a custom OEM enclosure
  • You are replacing an existing low-bar-count diode laser stack

For higher output power, longer operating periods or more demanding thermal loads, a water-cooled diode laser stack may be more appropriate.

The correct cooling method should therefore be selected according to the output power, operating current, pulse width, repetition rate, duty cycle, ambient temperature and available airflow of the final system.

 

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Forced-Air Cooling Requirements

The XTB 50W–150W air-cooled laser diode stack uses forced-air heat dissipation instead of an external water-cooling loop. This simplifies integration, but effective cooling still depends on how the laser stack is installed and operated inside the final OEM system.

For reliable operation, the cooling design should be evaluated together with the output power, drive current, pulse width, repetition rate, duty cycle, ambient temperature and enclosure airflow.

Maintain a Clear Airflow Path

A cooling fan can only remove heat effectively when air can move freely across the heat-generating area and leave the enclosure without recirculating hot air.

When integrating the XTB diode laser stack, the equipment design should provide:

  • A clear cool-air inlet
  • An unobstructed airflow path around the laser stack
  • Sufficient outlet area for heated air
  • Adequate spacing between the fan, heatsink and enclosure walls
  • Separation between hot exhaust air and the cooling-air inlet

Avoid placing the stack in a sealed compartment where heated air continuously circulates around the module.

For compact equipment, airflow direction should be considered during the mechanical design stage rather than after the laser stack has already been installed.

Do Not Block the Fan or Heat-Dissipation Area

The forced-air-cooled diode laser stack requires sufficient space around the cooling structure.

Cables, control boards, power supplies and enclosure panels should not block the fan inlet or restrict the hot-air outlet.

Restricted airflow can increase the operating temperature even when the electrical parameters remain within the nominal specification.

When designing a compact OEM system, leave enough clearance for both:

air intake → heat transfer → hot-air exhaust

rather than considering only whether the laser stack physically fits inside the enclosure.

Cooling Requirements Depend on Duty Cycle

Thermal load is determined not only by the rated optical output power.

A 50W, 100W or 150W laser diode stack can experience very different thermal conditions depending on how it is driven.

Important operating parameters include:

  • Drive current
  • Pulse width
  • Repetition frequency
  • Duty cycle
  • Continuous operating time
  • Cooling-air temperature

For example, increasing the pulse duration or duty cycle increases the average thermal load even if the peak optical output remains unchanged.

Therefore, the specified operating limits should be verified under the customer's actual drive conditions before the laser stack is integrated into production equipment.

Ambient Temperature Matters

Forced-air cooling uses the surrounding air as the heat-transfer medium.

If the ambient air entering the cooling system is already warm, the temperature difference available for heat removal becomes smaller.

OEM designers should therefore consider:

  • Maximum equipment operating temperature
  • Internal enclosure temperature
  • Heat generated by nearby power electronics
  • Fan inlet temperature
  • Ventilation of the complete machine

A fan-cooled laser diode stack should not be evaluated only at room temperature if the final equipment will operate inside a warmer enclosure.

Prevent Hot-Air Recirculation

One of the most common problems in compact equipment is hot-air recirculation.

If exhaust air from the laser stack is drawn back into the fan inlet, cooling performance can decrease significantly even though the fan itself is operating normally.

A better enclosure design creates a defined thermal path:

Cool Air In → Laser Stack / Heatsink → Hot Air Out

rather than allowing air to circulate randomly inside the machine.

Air ducts, vents or internal partitions can be considered when the enclosure is particularly compact.

Heat-Sink Contact and Mechanical Installation

Airflow is only one part of the thermal-management system.

Heat must first transfer efficiently from the laser diode structure to the heat-dissipation components before it can be removed by the airflow.

During installation, pay attention to:

  • Flat and stable mounting surfaces
  • Correct mechanical fixing
  • Proper contact with the designated heat-dissipation surface
  • Avoiding mechanical distortion of the laser stack
  • Keeping thermal interfaces clean
  • Following the specified mounting method

Poor mechanical or thermal contact can create local hot spots that cannot be solved simply by increasing fan speed.

Keep the Cooling System Clean

Dust accumulation can gradually reduce airflow and thermal performance.

For equipment operating in dusty environments, OEM manufacturers should consider:

  • Filtered air inlets
  • Accessible fan and vent locations
  • Regular cleaning intervals
  • Preventing dust from accumulating on the heatsink
  • Periodic fan inspection

This is especially important for compact laser equipment where the cooling channels and internal clearances may be relatively small.

Fan Monitoring Is Recommended for OEM Systems

For production equipment, the cooling fan should ideally be treated as part of the system safety and reliability design.

Depending on the application, the OEM controller can monitor:

  • Fan operation
  • Fan speed
  • Stack temperature
  • Heatsink temperature
  • Over-temperature condition

If abnormal cooling is detected, the system can reduce laser output or stop laser operation before excessive temperature develops.

This is particularly useful in systems where the diode laser stack operates repeatedly over long service periods.

Recommended Engineering Check Before Integration

Before approving the XTB stack for an OEM project, evaluate the complete thermal operating condition:

Cooling Factor What to Confirm
Output Power 50W / 100W / 150W configuration
Bar Count 1 / 2 / 3 bars
Drive Current Actual operating current
Pulse Width Maximum pulse duration
Repetition Rate Actual operating frequency
Duty Cycle Maximum expected duty cycle
Ambient Temperature Maximum inlet-air temperature
Airflow Unobstructed cooling-air path
Enclosure Design Adequate inlet and exhaust area
Installation Correct mechanical and thermal contact
Monitoring Fan and temperature protection if required

When Should You Choose Water Cooling Instead?

Forced-air cooling is most suitable when the required output power and duty cycle remain within the thermal capability of the compact XTB platform.

A water-cooled laser diode stack should be considered when the application requires:

  • Significantly higher optical output power
  • Higher bar count
  • Longer continuous operating periods
  • Higher average thermal load
  • Higher repetition rate or duty cycle
  • More stable temperature control
  • Operation in a high-temperature enclosure
  • Thermal conditions that exceed the capacity of forced-air cooling

The goal is not to use air cooling in every application, but to select the simplest cooling architecture that can safely maintain the diode stack within its specified operating conditions.

Send Us Your Operating Conditions for Thermal Evaluation

If you are integrating the XTB into a new laser system, provide the following information:

Wavelength + output power + drive current + pulse width + frequency + duty cycle + ambient temperature + available installation space.

We can evaluate whether the 50W, 100W or 150W forced-air-cooled laser diode stack is suitable for your operating conditions and help confirm the appropriate configuration before sample production.

 

 

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OEM & Custom Laser Diode Stack Solutions

The XTB series can be customized for OEM equipment, compact laser systems and replacement projects. We can evaluate the required wavelength, output power, bar count, electrical parameters and mechanical interface before confirming the suitable configuration.

Custom XTB Configurations

Available customization options can include:

  • 50W / 100W / 150W output
  • 1-bar / 2-bar / 3-bar configuration
  • 755nm, 808nm or 1064nm wavelength options
  • Operating current and voltage matching
  • Mechanical dimensions and mounting interface
  • Fan position and airflow arrangement
  • Electrical terminal or connector position

For OEM projects, please provide your required wavelength, power, working current, pulse width, duty cycle and available installation space.

Replacement Laser Diode Stack

The XTB can also be evaluated as a replacement laser diode stack for existing equipment.

To check compatibility, customers can provide:

  • Existing stack photo or drawing
  • Wavelength
  • Output power
  • Number of bars
  • Working current and voltage
  • Mechanical dimensions
  • Mounting-hole position
  • Cooling method

We can compare these specifications with the XTB platform and determine whether a standard or modified solution is suitable.

OEM Sample Before Batch Production

For customized projects, we recommend confirming the configuration before mass production:

Requirement review → configuration selection → drawing confirmation → sample evaluation → batch production

This helps ensure that the selected air-cooled laser diode stack matches the customer's electrical, mechanical and cooling requirements.

Need a Custom XTB Diode Laser Stack?

Send us your wavelength, output power, current, pulse parameters, dimensions and quantity.

We can help evaluate the appropriate 50W, 100W or 150W XTB laser diode stack for your OEM or replacement project.

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